LTM4700 uModule Regulator Structure and Implementation Analysis Report
Adopting excellent heat dissipation package technology and analyzing its heat removal circuit!
We provide an analysis report titled "ANALOG DEVICES PSiP (Power Supply in Package) LTM4700 uModule Regulator Structure and Implementation Analysis Report," which selects and analyzes representative products to clarify the packaging technology used in advanced PSiP. This analysis report reveals the technologies used to achieve the performance of the LTM4700 product. [Report Contents] - Structure and package layout of high-current switching MOSFETs - HS/LS half-bridge, source-down configuration of LS FETs - Shielded double poly-Si trench MOSFET structure for high area efficiency - Analysis of a double-sided Cu lead frame package - Identification of controller ICs, etc. *For more details, please download the PDF or feel free to contact us.
- Company：エルテック
- Price：Other
